Showing posts with label chips. Show all posts
Showing posts with label chips. Show all posts

Wednesday, 11 September 2013

Intel's new Quark chips target wearable computing

Intel has made its move to target the emerging market for wearable computers with a new family of low-power chips called Quark. Intel said its new Quark X1000 chips are about one-fifth the size and consume one-tenth the power of its Atom processors, its current most-power-efficient line of chips.

But while Atom processors are aimed at tablets and smartphones, Quark will be for devices with even lower-power requirements, such as smartwatches, glasses, and medical devices that can be worn about the body.

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Quark is also aimed at the Internet of things, where compute power and connectivity are embedded into everyday objects, said Intel president Renee James, at the Intel Developer Forum om Tuesday.

The market for wearables is gaining steam, with products such as Google Glass and Samsung's Galaxy Gear smartwatch, and Intel has been in danger of getting left out. As part of its wearables effort, Intel has hired the designer of the Nike FuelBand, Steve Holmes, and a developers of Oakley's Airwave heads-up display and other eyewear, Hans Moritz. It also recently moved a former top mobile executive to head a "new devices" group.

Intel CEO Brian Krzanich showed rough prototypes of wearable devices, including a watch that appeared to be little more than a computer chip strapped to a wrist band. Another device resembled a chunky plastic bracelet. Intel won't make the devices, but it will create reference designs for partners to work with, as it does with laptops and other products.

The Quark chips could also be used in car headlights, James said, for a technology Intel has shown before that makes it easier for drivers to see when driving in rain or snow at night. The technology detects falling raindrops or snowflakes and deflects the headlights around them, reducing reflection and making it easier to see.

James also showed a prototype wearable medical patch that she said can monitor a patient's EKG, blood pressure, and other vitals, and send the information directly to the doctor.

Intel's challenge has been reducing power consumption of its chips sufficiently to enter such markets, and its top executives apparently have high hopes for Quark. It will do battle with microcontrollers based on ARM, MIPS, and IBM Power designs, which are strong in those markets today. Microcontrollers are used in all modern cars to run airbags and antilock braking systems, for example.

Customers who need it will be able to use customized versions of Quark, and the chips will run standard x86 software, Krzanich said. Intel has been pushing developers to write new applications for the architecture. It will be easy for customers to add their own intellectual property to the Quark designs, Krzanich said.

Big changes like DRAM integration may be difficult may be difficult at first but will get easier as the chips develop. Third parties will also be able to attach sensors and accelerators to the chips.

Other chip makers are also building devices to show what their embedded chips are capable of. Qualcomm, which makes ARM-based chips, recently introduced the Toq smartwatch to show its hardware and software technologies.

Intel's experimental chip designs are essentially an evolution of its early Pentium designs, but they have come a long way. It has demonstrated a PC that uses a "near-theshold voltage" chip, which was powered by light generated from a bulb.

Agam Shah covers PCs, tablets, servers, chips and semiconductors for IDG News Service. Follow Agam on Twitter at @agamsh. Agam's e-mail address is agam_shah@idg.com


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Wednesday, 28 August 2013

Intel set to ship new Atom server chips

IDG News Service - Intel is expected to announce availability next week of a low-power Atom server chip code-named Avoton, which is likely to appear soon in systems such as Hewlett-Packard's Moonshot.Avoton chips will become part of Intel's Atom C2000 product family and be used in high-density servers from multiple vendors, said a source familiar with Intel's plans.

Intel is expected to announce the chip at an event in San Francisco about hyperscale data centers.

Other Atom chips expected to launch next week include the "Rangeley" processor for networking systems.

The Avoton chips will succeed Intel's first line of Atom S1200 server chips, code-named Centerton, which are used in HP's current Moonshot server. Avoton will be based on the Silvermont architecture, the first major architectural redesign for Atom in six years.

Intel's upcoming tablet chip, code-named Bay Trail, is also based on Silvermont. Intel has claimed Avoton will be up to seven times faster and four times more power efficient than Centerton, which shipped in December.

Avoton will have up to eight cores, up to 64GB of memory, and include integrated Ethernet networking. Avoton will be manufactured using a 22-nanometer process. Actual figures for power consumption and clock speed have not yet been released. Avoton is

Intel's answer to an emerging threat from ARM in the market for high-density servers. ARM chips are based on a different instruction set and are found in many smartphones and tablets.

HP has said it will also use ARM processors in Moonshot, and chip makers Calxeda, Advanced Micro Devices, Nvidia and AppliedMicro are expected to release ARM chips in the next year.

A collection of low-power chips packed into racks of high-density servers are considered optimal for workloads comprising a high volume of lightweight transactions, such as serving search results or social network posts.

Intel has something of an early mover advantage along with support for 64-bit computing, but that's coming soon to ARM chips. Some other features in Avoton may lend themselves to slightly more heavyweight tasks, such as transaction processing for databases.

Agam Shah covers PCs, tablets, servers, chips and semiconductors for IDG News Service. Follow Agam on Twitter at @agamsh. Agam's e-mail address is agam_shah@idg.com

Reprinted with permission from IDG.net. Story copyright 2012 International Data Group. All rights reserved.

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Sunday, 25 August 2013

Toshiba takes step toward 3D flash memory chips

IDG News Service - Toshiba kicked off a project Friday that is the first step toward a new type of memory chip that could provide vastly greater capacity at a lower cost for digital gadgets such as cameras, smartphones and tablets.

The company held a groundbreaking ceremony to begin expansion of its number-five chip fabrication building (fab 5) in Yokkaichi, a state-of-the-art chip production facility in central Japan operated by Toshiba and SanDisk under a joint venture.

The construction, which is scheduled to last a year, will see the production line expanded to accommodate additional chip fabrication capacity for NAND flash memory, including more advanced conventional manufacturing processes and early generation 3D production techniques.

3D chips are tipped to be the next big thing in the memory market and provide greater data storage capacity by stacking memory cells in layers. Using this method, greatly higher storage capacity can be realized while keeping the chips small enough to fit inside flash memory cards and the cramped insides of modern gadgets.

The project also indicates Toshiba's intention to remain a leader in the competitive flash memory market and also the company's belief that the market will continue to expand.

"After giving careful consideration to the balance of product supply and demand, and noting a recovery driven by growing demand for smartphones, tablets, SSD for enterprise servers, Toshiba now anticipates further medium- to long-term market expansion," the company said in a statement.

Martyn Williams covers mobile telecoms, Silicon Valley and general technology breaking news for The IDG News Service. Follow Martyn on Twitter at @martyn_williams. Martyn's e-mail address is martyn_williams@idg.com

Reprinted with permission from IDG.net. Story copyright 2012 International Data Group. All rights reserved.

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Saturday, 24 August 2013

Toshiba takes step toward 3D flash memory chips

Toshiba kicked off a project Friday that is the first step toward a new type of memory chip that could provide vastly greater capacity at a lower cost for digital gadgets such as cameras, smartphones and tablets.

The company held a groundbreaking ceremony to begin expansion of its number-five chip fabrication building (fab 5) in Yokkaichi, a state-of-the-art chip production facility in central Japan operated by Toshiba and SanDisk under a joint venture.

[ Keep up on the day's tech news headlines with InfoWorld's Today's Headlines: Wrap Up newsletter. ]

The construction, which is scheduled to last a year, will see the production line expanded to accommodate additional chip fabrication capacity for NAND flash memory, including more advanced conventional manufacturing processes and early generation 3D production techniques.

3D chips are tipped to be the next big thing in the memory market and provide greater data storage capacity by stacking memory cells in layers. Using this method, greatly higher storage capacity can be realized while keeping the chips small enough to fit inside flash memory cards and the cramped insides of modern gadgets.

The project also indicates Toshiba's intention to remain a leader in the competitive flash memory market and also the company's belief that the market will continue to expand.

"After giving careful consideration to the balance of product supply and demand, and noting a recovery driven by growing demand for smartphones, tablets, SSD for enterprise servers, Toshiba now anticipates further medium- to long-term market expansion," the company said in a statement.

Martyn Williams covers mobile telecoms, Silicon Valley and general technology breaking news for The IDG News Service. Follow Martyn on Twitter at @martyn_williams. Martyn's e-mail address is martyn_williams@idg.com


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